Description

In the face of growing demands for data transmission and challenges in power efficiency, Dimension Technologies leads the innovation in Co-Packaged Optics (CPO) and Network Processor Offload (NPO) technologies, providing comprehensive testing solutions for ultra-large-scale data centers. Our goal is to ensure that CPO/NPO technologies meet the highest standards of performance and reliability in practical applications.

CPO/NPO Co-Packaging Technology Assessment and Testing:

The key to assessing and testing CPO/NPO technology lies in the micro-connectors between ASIC internal switch chips and optical modules. We focus on testing the overall system's optical signal transmission quality and the comprehensive performance of optical ports.

Optical Engine Light Signal Testing

-Evaluate the quality of optical digital signals based on the 800GBASE standard.

-Use TDECQ as the PAM4 waveform evaluation metric.

Dimension Technologies introduces the BERT 800 high-speed error generator and CDR 800 clock recovery instrument, adapted for high-speed optical signal evaluation in CPO modules at 400G/800G.

CPO Switch Module Ethernet Signal Testing

·Evaluation scope: Performance assessment covering the physical layer and above.

·Testing method:Utilize PAM4 modulation and 400GBASE optical signals, with a focus on evaluating error-free data transmission and the efficiency of FEC algorithms.

·OMEGA Testing Platform:Dimension Technologies' OMEGA testing platform integrates several testing modules, including success rate calculation, optical switches, attenuators, and error analyzers. This platform offers an integrated, efficient, and rigorous testing solution for CPO optical modules.

High speed optical module micro connection

After years of independent research and development, Dimension has launched an intelligent, fast, efficient, and reliable overall solution for end face detection and cleaning for high-speed optical module micro connectors. This mainly includes: end face cleaning, end face defect detection, end face 3D morphology detection, and insertion loss performance testing.