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PIC Testing and Packaging for Silicon Photonics

Silicon Photonics Technology is based on silicon and silicon-based substrate materials, utilizing existing CMOS processes for the development and integration of optical devices.

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Description

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Silicon Photonics Technology is based on silicon and silicon-based substrate materials, utilizing existing CMOS processes for the development and integration of optical devices. It combines integrated circuit technology with photonic integration technology, representing an inevitable direction for miniaturizing high-bandwidth optical transceivers. Silicon Photonics chips leverage silicon-based materials to manufacture optical components, processing light signals on tiny silicon wafers to achieve faster data transmission, higher efficiency, and lower energy consumption.


The Silicon Photonics Wafer serves as the foundational material for Silicon Photonics chips, achieving high-precision optical functions through integrated circuit manufacturing processes. In the field of optical communication, Silicon Photonics chips enable higher bandwidth, longer transmission distances, cost reduction, and lower energy consumption, significantly driving the development of data centers and communication networks.


Testing Processes and Development Challenges

The testing process for Silicon Photonics chips includes measurements of optical performance, beam analysis, and detection of optical fiber connectivity, among other aspects. During this process, development teams may encounter challenges such as high-precision optical measurements, precise control of fiber alignment, and the impact of environmental factors on optical performance.

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How to Address These Challenges?

To address these challenges, Dimension Tech provides an array of advanced equipment and solutions:

BeamHere Spot Analyzer: This instrument accurately measures the size and shape of light spots, crucial for optimizing the design and testing of photonics chips.

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Optical Performance Testing Equipment: These devices comprehensively test the performance of optical components, including wavelength, intensity, polarization, and other critical parameters, ensuring high performance of Silicon Photonics chips.

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Insertion Loss and Polarity Tester:These testers assess the quality of fiber connections, including loss and correct signal transmission direction, essential for ensuring efficient optical communication.

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Fiber End-face Interferometer:This equipment detects the quality of fiber end-faces, ensuring the morphological inspection of micro-optical connectors inside Silicon Photonics chips.

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By utilizing these high-precision and advanced devices, Dimension Tech delivers comprehensive Silicon Photonics chip testing solutions, assisting customers in overcoming technical challenges in the field of optical communication.


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